Course name: Tecnologie e materiali per l'elettronica
Course code: 062213
Degree course: Ingegneria Elettronica e delle Telecomunicazioni
Disciplinary field of science: ING-INF/01
L'insegnamento è caratterizzante per: Ingegneria Elettronica e delle Telecomunicazioni
University credits: CFU 5
Course website: http://www-3.unipv.it/ingegneria/didattica/schedacorso0
Specific course objectives
The Electronic materials and technologies course provides basic knowledge on production technology of passive electronic components, technology interconnect (printed circuit boards, hybrid circuits) and silicon-based monolithic integrated circuits technologies.
The aim of the curse is to guide the student to think in terms of technological feasibility.
The course is directed to students who will work in design, production, application and management of products and electronic systems.
In the first part the course provides an introduction to key technologies for manufacturing integrated circuits and individual technological steps associated with them.
The second part of the course provides an overview of key technologies and materials used in the manufacture and assembly of electronic components and systems.
Introduction to silicon monolithic integrated circuit technology
- Integrated circuits
- Basic operations in planar technology:
- thin layers deposition,
- thermal diffusion and oxidation,
- masking and etching
- MOS and bipolar integration technology.
Printed circuit technologies
- Materials for printed circuits.
- Technological steps for the realization of printed circuit boards.
- Production processes:
- single-sided PCB
- double sided and multilayer.
- welding techniques
- surface mount and insertion mount
- pressure connections.
- Thermal design: heat resistance and thermal capacity.
- Plastic and ceramic materials
- Magnetic Materials
- Piezoelectric materials
Hybrid circuits technology
- Introduction to technology of thick film hybrid circuits
- Materials for thick film hybrid circuits
- Processes of screen printing and firing
- Calibration and assembly of discrete components in thick film hybrid circuits
Course entry requirements
Foundations of Physics and Technical Physics (in particular, electromagnetism, heat transfer mechanisms).
Basics of Chemistry (in particular chemical elements and compounds, valence, reactions, crystals, phase diagram, electrolytic cells).
Foundations of electrical engineering (including: concepts of impedance and electric dipoles).
Foundations of Electronics (with special electrical characteristics of silicon BJT and MOS transistors on foundations, single-pole RC filter).
Course structure and teaching
Lectures (hours/year in lecture theatre): 37
Practical class (hours/year in lecture theatre): 1
Practicals / Workshops (hours/year in lecture theatre): 0
Suggested reading materials
Dispense di G. Torelli. Introduzione alla tecnologia dei circuiti integrati su silicio. Edizioni CUSL, 2006. Testo di riferimento per la prima parte del programma.
G. Torelli, S. Donati. Tecnologie e Materiali per l'Elettronica. Edizioni CUSL, Pavia,1999. The book is available only in italian.
C. F. Coombs, Jr.. Printed Circuits Handbook, Fourth Edition. McGraw Hill, 1996. The book provides advanced information on printed circuits technologies..
D. W. Hamer, J. V. Biggers. Thick Film Hybrid Microcircuit Technology. Wiley-Interscience. Advanced book on thick film hybrid technologies.
Testing and exams
The exams cosist in written and oral tests.
Final mark is determined 1/3 by the written test and 2/3 by the oral test. Two ongoing tests will be carried out during the course: the candidates that successfully pass these tests will not be required to carry out the written test.