Lecturer: Guido Torelli  

Course name: Tecnologie dei circuiti integrati
Course code: 064100
Degree course: Ingegneria Elettronica
Disciplinary field of science: ING-INF/01
L'insegnamento è caratterizzante per: Ingegneria Elettronica e delle Telecomunicazioni
University credits: CFU 5
Course website: n.d.

Specific course objectives

The main objective of the course is to provide the student with the basics of silicon monolithic integrated circuit fabrication technology. At the end of the course, the student is expected to know the basics of monolithic integration technology (in particular, of CMOS technology) and be able to evaluate the impact of integration technology over the design and the performance of integrated circuits. In addition, the basics of piezoelectric and electrostrictive devices will be provided. The course is intended for students who will carry on their future professional activity in the areas of design, production, application, and management of integrated circuits and devices, equipments, and systems including such circuits.

Course programme

Piezoelectric and electrostrictive materials
Piezoelectricity. Quartz crystal: electrical characteristics; fabrication technology; applications; quartz oscillator. Electrostrictive and magnetostrictive materials; transducers. Surface acoustic waves devices.

Silicon planar technology
Semiconductors. Silicon ingot fabrication and wafer preparation. Basic processing steps for silicon planar technology: thermal oxidation; thermal diffusion; ion implantation; chemical vapour deposition; physical vapour deposition; epitaxy; annealing: gettering; lithography (selective exposure, exposure techniques, mask making; selective etching). Planarization.

Integrated circuit packaging
Production flow from fabricated wafer to packaged die. Yield; yield at the wafer level. Testing (wafer sort; final testing). Packages for integrated circuits: metallic, ceramic, and plastic packages. Assembly and packaging process. Use of non encapsulated devices. Multi-chip modules.

Monolithic integration technologies
MOS technology; CMOS fabrication process. Bipolar fabrication technology. Mixed fabrication technologies. Electrostatic discharges and latch-up in CMOS integrated circuits.

Course entry requirements

Basics of Physics and Thermal Sciences; Chemistry; Electronics; Technology and Materials for Electronics.

Course structure and teaching

Lectures (hours/year in lecture theatre): 26
Practical class (hours/year in lecture theatre): 22
Practicals / Workshops (hours/year in lecture theatre): 4

Suggested reading materials

G. Torelli, S. Donati. Tecnologie e Materiali per l'Elettronica. Edizioni CUSL, Pavia, 1999. For the part of the program regarding piezoelectric and electrostrictive materials (first point of the program).

R. C. Jaeger. Introduction to Microelectronic Fabrication, 2nd Edition. Prentice-Hall, Upper Saddle River, NJ, USA, 2002. For the part of the program regarding integrated circuit technologies (second, third, and fourth point of the program).

J. D. Plummer, M. D. Deal, P. B. Griffin. Silicon VLSI Technology: Fundamental, Practice and Modeling. Prentice-Hall, Upper Saddle River, NJ, USA, 2000. For more details on integrated circuit technologies.

C. Y. Chang, S. M. Sze (Editors). ULSI Technology. The McGraw-Hill Companies, New York, NY, USA, 1996. For more details on integrated circuit technologies, together with the textbook below.

S. M. Sze (Editor). VLSI Technology. McGraw-Hill International Editions, 1988. For more details on integrated circuit technologies, together with the textbook just above.

Testing and exams

Oral examination (during the exam, some components and/or electronic parts will be provided to the student for discussion). The Examination Commission' can decide that the oral examination be preceded by a written examination.