Lecturer: Danilo Manstretta  

Course name: Tecnologie e materiali per l'elettronica
Course code: 503034
Degree course: Ingegneria Elettronica e delle Telecomunicazioni
Disciplinary field of science: ING-INF/01
University credits: CFU 6
Course website: http://www-3.unipv.it/ingegneria/didattica/schedacorso0
910.php?cod=062213&spec=0

Specific course objectives

The Electronic materials and technologies course provides basic knowledge on production technology of passive electronic components, technology interconnect (printed circuit boards, hybrid circuits) and silicon-based monolithic integrated circuits technologies.
The aim of the curse is to guide the student to think in terms of technological feasibility.
A lab activity is carried out during the course to enhance students familiarity with actual electronic components and the related technologies.
The course is directed to students who will work in design, production, application and management of products and electronic systems.

Course programme

In the first part the course provides an introduction to key technologies for manufacturing integrated circuits and individual technological steps associated with them.
The second part of the course provides an overview of key technologies and materials used in the manufacture and assembly of electronic components and systems.

Introduction to silicon monolithic integrated circuit technology

• Integrated circuits
  
• Basic operations in planar technology:
  - thin layers deposition,
  - thermal diffusion and oxidation,
  - masking and etching
  
• MOS and bipolar integration technology.
  
• Packaging
  
• Testing

Printed circuit technologies

• Materials for printed circuits.
• Technological steps for the realization of printed circuit boards.
• Production processes: single-sided PCB, double sided and multilayer.
• Assembly:
  - welding techniques
  - surface mount and insertion mount
  - pressure connections.
• Thermal design: heat resistance and thermal capacity.

Lab activity

• Physical implementation of a printed circuit and components assembling

Passive Components

• Plastic and ceramicmaterials
• Resistors
• Capacitors
• Magnetic Materials
• Piezoelectric materials

Hybrid circuits technology

• Introduction to technology of thick film hybrid circuits
• Materials for thick film hybrid circuits
• Processes of screen printing and firing
• Calibration and assembly of discrete components in thick film hybrid circuits

Course entry requirements

Course structure and teaching

Lectures (hours/year in lecture theatre): 37
Practical class (hours/year in lecture theatre): 1
Practicals / Workshops (hours/year in lecture theatre): 22

Suggested reading materials

Dispense di G. Torelli. Introduzione alla tecnologia dei circuiti integrati su silicio. Edizioni CUSL, 2006. Reference text for the first part of the course (available only in Italian).

G. Torelli, S. Donati. Tecnologie e Materiali per l'Elettronica. Edizioni CUSL, Pavia,1999. Reference text for the second part of the course. The book is available only in italian.

C. F. Coombs, Jr.. Printed Circuits Handbook, Fourth Edition. McGraw Hill, 1996. The book provides advanced information on printed circuits technologies. Suggested reading, not strictly required..

D. W. Hamer, J. V. Biggers. Thick Film Hybrid Microcircuit Technology. Wiley-Interscience. Advanced book on thick film hybrid technologies. Suggested reading, not strictly required..

Testing and exams

The exams cosist in written and oral tests. Final mark is determined 1/3 by the written test and 2/3 by the oral test.